LAM 853-049542-173 precision gas flow control module
LAM 853-049542-173 precision gas flow control module
The LAM 853-049542-173 is a precision gas flow control module, integral to LAM Research’s portfolio of semiconductor manufacturing equipment. It’s specifically engineered to integrate with LAM’s Endura® and Versys® platform etch and deposition systems, serving as a critical link in the process control architecture.
Model LAM 853-049542-173
Brand LAM Research
Type Precision Gas Flow Control Module
Power Supply 24 V DC ± 10%
Operating Temperature 15°C to 40°C
Mounting Panel Mount with Quick-Connect Brackets
Dimensions 120 mm x 85 mm x 45 mm
Weight 0.5 kg
Interfaces RS-485, Ethernet (SECS/GEM compliant)
Certifications ISO 9001, SEMI S2/S3, CE
Cooling Passive (Conduction-Cooled)
Environmental Rating Class 1 Cleanroom Compatible
Flow Control Range 0.1 sccm to 500 sccm
Pressure Rating 0 to 50 psig (inlet)
The LAM 853-049542-173 is a precision gas flow control module, integral to LAM Research’s portfolio of semiconductor manufacturing equipment. It’s specifically engineered to integrate with LAM’s Endura® and Versys® platform etch and deposition systems, serving as a critical link in the process control architecture.
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In these systems, the LAM 853-049542-173 acts as the gatekeeper for gas delivery, regulating the flow of specialty gases (such as fluorocarbons or inert carriers) into reaction chambers. What sets it apart is its ability to maintain consistent flow rates even as system pressures fluctuate— a feature that directly impacts wafer uniformity and process repeatability. For process engineers and equipment integrators, its value lies in reducing scrap rates and simplifying system calibration, ultimately lowering operational costs while ensuring compliance with strict semiconductor industry standards.
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Main features and advantages:
The LAM 853-049542-173 excels in functional performance, with a flow control range of 0.1 sccm to 500 sccm—covering the precise needs of both low-flow etching processes and higher-volume deposition steps. Its closed-loop feedback system adjusts flow rates in real time, with a response time of less than 200 milliseconds, ensuring minimal disruption when process parameters shift. This level of speed is critical in high-throughput fabs where even a momentary deviation can affect hundreds of wafers.
Hardware design prioritizes the unique demands of semiconductor cleanrooms. The LAM 853-049542-173 features a corrosion-resistant nickel-plated housing to withstand aggressive process gases, while its hermetically sealed connectors prevent gas leakage—a non-negotiable for safety and purity. Its compact form factor (15% smaller than predecessor models) allows for denser packing in system cabinets, freeing up space for additional process modules.
Compatibility is another strength: it integrates seamlessly with LAM’s proprietary GFC (Gas Flow Controller) software and supports industry-standard communication protocols like SECS/GEM, enabling easy integration into existing fab-wide control networks. Long-term reliability is ensured by a thermal management system that operates efficiently in the 15°C to 40°C range typical of cleanrooms, with a mean time between failures (MTBF) exceeding 100,000 hours—critical for minimizing unplanned downtime in 24/7 production environments.
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Technical specifications:
Model LAM 853-049542-173
Brand LAM Research
Type Precision Gas Flow Control Module
Power Supply 24 V DC ± 10%
Operating Temperature 15°C to 40°C
Mounting Panel Mount with Quick-Connect Brackets
Dimensions 120 mm x 85 mm x 45 mm
Weight 0.5 kg
Interfaces RS-485, Ethernet (SECS/GEM compliant)
Certifications ISO 9001, SEMI S2/S3, CE
Cooling Passive (Conduction-Cooled)
Environmental Rating Class 1 Cleanroom Compatible
Flow Control Range 0.1 sccm to 500 sccm
Pressure Rating 0 to 50 psig (inlet)
Contact Us Phone:+86 16626708626 WeChat/WhatsApp:+86 16626708626 Email: 3772179818@qq.com
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Application areas:
In semiconductor manufacturing, where even the smallest defect can derail production, precision and reliability in process control are critical. The LAM 853-049542-173 thrives in these high-stakes environments, particularly within plasma etching systems used to create intricate patterns on silicon wafers. Foundries producing advanced microchips rely on it to regulate gas flow rates with pinpoint accuracy during etching processes, ensuring uniform material removal across wafer batches—a task where variance as small as 0.1% can compromise chip performance.
This component is equally vital in deposition systems, where it maintains stable pressure levels within vacuum chambers, a necessity for depositing thin films evenly. Used in industrial automation setups across leading semiconductor facilities, the LAM 853-049542-173 addresses the industry’s unique challenges: extreme cleanliness requirements, tight process tolerances, and the need for uninterrupted operation to meet high-volume production targets. Its design aligns with the rigorous demands of fabs producing everything from memory chips to advanced logic devices, making it a trusted choice for engineers focused on yield optimization.
Related products:
LAM 853-049542-174 – Higher-flow variant, handling up to 2000 sccm for bulk deposition processes. LAM 853-049542-169 – Lower-flow model optimized for atomic layer deposition (ALD) with 0.01 sccm precision. LAM 853-049542-201 – Valve manifold module that pairs with LAM 853-049542-173 to manage gas switching between process lines. LAM 853-049542-187 – Calibration standard module used to verify LAM 853-049542-173 accuracy during preventive maintenance. LAM 853-049542-192 – Redundant power supply unit designed to ensure uninterrupted operation of LAM 853-049542-173 in critical processes. LAM 853-049542-210 – Gas purging module that works with LAM 853-049542-173 to minimize cross-contamination between gas changes. LAM 853-049542-155 – Legacy model predecessor, with limited compatibility with newer LAM software suites.
Installation and maintenance:
Pre-installation, verify that the mounting panel can support the module’s weight with a safety margin of 50% to account for vibration in fab environments. Ensure the inlet gas lines are thoroughly cleaned and pressure-tested to 60 psig (10 psig above maximum operating pressure) to prevent particulate contamination—even minor debris can damage the module’s internal flow sensors. Grounding must comply with SEMI S2 standards, with a dedicated 4 AWG ground wire connected to the module’s chassis to avoid electrical noise interference.
For maintenance, schedule visual inspections every 6 months to check for corrosion or loose fittings, particularly in systems handling halogenated gases. Calibration should be performed annually using LAM’s certified standards to maintain flow accuracy within ±1% of setpoint. The LAM853-049542-173’s firmware should be updated quarterly via LAM’s ServiceConnect portal to ensure compatibility with the latest process control algorithms—critical for maintaining optimal performance as fab processes evolve.
WhatsApp: +86 16626708626
Email: 3772179818@qq.com
Phone: +86 16626708626
