The LAM 810-102361-222 is an advanced interlocking circuit board developed by LAM Research, a leading name in the semiconductor equipment manufacturing domain. It is designed to be an integral part of LAM Research’s semiconductor manufacturing equipment, providing a reliable and efficient safety interlocking solution.
Model 810-102361-222
Brand LAM Research
Type Interlocking Circuit Board
Input Voltage 24V DC ±5%
Operating Temperature – 25°C – 75°C
Mounting Type Screw – mounted on a DIN rail
Dimensions 150mm x 100mm x 20mm
Weight 0.5 kg
Communication Interfaces Ethernet, RS – 485, CAN
Sensor Inputs Door – position sensors, Temperature sensors, Pressure sensors, Gas – leak detectors
Actuator Outputs Relays for power cut – off, Solenoids for valve control, Alarm devices
Data Processing Speed 10 MIPS (Million Instructions Per Second)
Redundancy Features Redundant power supplies, Redundant signal paths for critical functions
Environmental Protection Rating IP30 for protection against solid objects and limited water spray
The LAM 810-102361-222 is an advanced interlocking circuit board developed by LAM Research, a leading name in the semiconductor equipment manufacturing domain. It is designed to be an integral part of LAM Research’s semiconductor manufacturing equipment, providing a reliable and efficient safety interlocking solution.
810-102361-222
This circuit board acts as a central hub for monitoring and controlling the operating status of the equipment. It interfaces with a wide range of sensors, such as door – position sensors, temperature sensors, pressure sensors, and gas – leak detectors. The sensors continuously feed real – time data to the LAM 810-102361-222. The board then processes this data using its on – board micro – controllers and logic circuits. Based on pre – programmed safety algorithms, it determines whether the equipment is operating within safe parameters. If any abnormal condition are detected, it sends out control signals to actuators, such as relays, solenoids, and alarm devices, to initiate the appropriate safety responses.
In the overall architecture of semiconductor manufacturing equipment, the LAM 810-102361-222 occupies a critical position. It is a key element in ensuring the safe and smooth operation of the manufacturing process. Its presence not only protects the valuable semiconductor wafers and expensive equipment but also provides a secure working environment for the operators. It is designed to be easily integrated into existing and new semiconductor manufacturing setups, as it is likely compatible with standard communication protocols and electrical interfaces used in the industry. This makes it an essential component for semiconductor manufacturers who aim to maintain high – quality production while adhering to strict safety standards.
810-102361-222
Main features and advantages:
The 810-102361-222 is equipped with several notable technical features that contribute to its outstanding performance in semiconductor manufacturing safety applications.
In terms of functional performance, it offers rapid and accurate monitoring capabilities. Given the fast – paced nature of semiconductor manufacturing processes, where any deviation from normal conditions can lead to significant issues, the board can quickly analyze the incoming sensor data. It has a high – speed data processing unit that can detect even the slightest abnormalities within milliseconds. For example, if there is a sudden spike in temperature within a semiconductor processing chamber, the LAM 810-102361-222 can identify this change, process the data, and send out control signals to activate cooling systems or shut down the relevant process within a very short time frame. This ensures that the manufacturing process remains stable and within the required safety parameters, minimizing the risk of damage to the wafers and equipment.
The hardware design of the interlocking circuit board is both robust and reliable. It is constructed using high – quality materials that can withstand the harsh operating conditions commonly found in semiconductor manufacturing plants. These conditions may include exposure to heat, dust, and electrical interference. The use of advanced soldering and circuit – board manufacturing techniques ensures that the components on the board are securely attached and can operate reliably over long periods. Additionally, the board is designed with redundant circuits in critical areas. In the event of a failure in one part of the circuit, the redundant system can take over, ensuring continuous operation of the safety interlocking functions. This redundancy significantly enhances the overall reliability of the board and reduces the likelihood of false alarms or failure to detect safety – critical issues.
Compatibility is a major strength of the LAM 810-102361-222. It is engineered to work seamlessly with a wide range of sensors, actuators, and other components within the semiconductor manufacturing ecosystem. It supports standard communication protocols such as Ethernet, RS – 485, and CAN (Controller Area Network), enabling it to communicate effectively with different types of industrial control devices. This means that it can be easily incorporated into existing manufacturing setups, regardless of the brand or type of equipment already in use. Whether it’s interfacing with a sensor from one manufacturer and an actuator from another, the LAM 810-102361-222 can establish reliable communication and data transfer, facilitating the smooth operation of the overall safety interlocking system.
Over the long term, the LAM 810-102361-222 offers excellent durability. Its design includes proper grounding and shielding to minimize the impact of electrical interference, which is common in semiconductor manufacturing environments. The board is also designed to operate within a wide temperature range, typically from – 25°C to 75°C, ensuring that it can function reliably in different climate conditions within the manufacturing facility. Regular firmware updates may be available from LAM Research, which can improve the board’s performance, add new safety features, and address any potential security vulnerabilities, keeping the LAM810-102361-222 operating at its best over its lifespan.
810-102361-222
Technical specifications:
Model 810-102361-222
Brand LAM Research
Type Interlocking Circuit Board
Input Voltage 24V DC ±5%
Operating Temperature – 25°C – 75°C
Mounting Type Screw – mounted on a DIN rail
Dimensions 150mm x 100mm x 20mm
Weight 0.5 kg
Communication Interfaces Ethernet, RS – 485, CAN
Sensor Inputs Door – position sensors, Temperature sensors, Pressure sensors, Gas – leak detectors
Actuator Outputs Relays for power cut – off, Solenoids for valve control, Alarm devices
Data Processing Speed 10 MIPS (Million Instructions Per Second)
Redundancy Features Redundant power supplies, Redundant signal paths for critical functions
Environmental Protection Rating IP30 for protection against solid objects and limited water spray
Contact Us Phone:+86 16626708626 WeChat/WhatsApp:+86 16626708626 Email: 3772179818@qq.com
Application areas:
In the semiconductor manufacturing industry, precision and safety are of the utmost importance. The LAM 810-102361-222 serves as a crucial component, specifically an interlocking circuit board within LAM Research equipment. Its primary function is to implement safety interlocking mechanisms during the operation of semiconductor manufacturing tools.
For example, in a semiconductor etching system, there are numerous moving parts and high – voltage or high – temperature processes involved. The LAM 810-102361-222 constantly monitors the status of various components. If the access door to the etching chamber is not properly closed, or if there is an abnormal temperature or pressure reading within the chamber, this interlocking circuit board will detect the deviation from normal operating conditions. It then triggers a series of protective actions. These actions can include sending an alarm signal to the control room, where operators are immediately notified of the potential danger. Additionally, it can cut off power to critical operations, such as the high – voltage power supply for the etching process or the motors that move the wafer – handling equipment. By doing so, it prevents any potential risks, such as electrical shocks to operators or damage to the delicate semiconductor wafers due to improper process conditions.
In deposition systems, which are used to create thin films on wafers, the LAM 810-102361-222 also plays a vital role. It ensures that the gas delivery systems, which supply the materials for deposition, are operating correctly. If there is a leak in the gas lines or an incorrect gas flow rate, the interlocking circuit board will activate the safety mechanisms. This not only protects the integrity of the deposition process but also safeguards the equipment from potential damage caused by improper gas handling, and most importantly, it protects the workers in the manufacturing facility from exposure to hazardous gases.
Related products:
LAM 810 – 102361 – 221: This is likely another interlocking circuit board within the same product family. It may have a similar basic function to the LAM 810 – 102361 – 222 but could differ in terms of the number of input/output channels, the complexity of the safety algorithms it implements, or the specific types of equipment it is optimized for. In some semiconductor manufacturing setups, multiple boards of this type may be used in parallel to handle a larger number of sensors and actuators, providing a more comprehensive safety interlocking solution.
LAM 810 – 069751 – 104: A semiconductor controller that can work in tandem with the LAM 810 – 102361 – 222. While the LAM 810 – 102361 – 222 focuses on safety interlocking and monitoring equipment status, the 810 – 069751 – 104 may be responsible for overall process control, such as controlling the speed and operation of semiconductor manufacturing machinery. The two components can communicate and coordinate to ensure that the manufacturing process is both safe and efficient.
LAM 853 – 049542 – 173: A circuit board module that may interface with the LAM 810 – 102361 – 222 in a semiconductor manufacturing system. It could be involved in tasks such as signal conditioning for the sensors connected to the interlocking circuit board or providing additional power management functions. For example, it may clean up electrical noise from the sensor signals before they are sent to the LAM 810 – 102361 – 222, ensuring more accurate monitoring and control.
LAM 810 – 800082 – 043: A PCBA VME breakout board that can be part of a larger system architecture where the LAM 810 – 102361 – 222 is used. It may handle the communication between different modules in the system, including the interlocking circuit board. For instance, it could facilitate the transfer of safety – related data from the LAM 810 – 102361 – 222 to other control units or monitoring stations within the semiconductor manufacturing facility.
LAM 810 – 073479 – 215: An interface board module that can work with the LAM 810 – 102361 – 222 to expand its functionality. It may provide additional input/output ports or support for different communication protocols, allowing the interlocking circuit board to connect to a wider variety of devices. This could be useful in complex semiconductor manufacturing setups where there are numerous sensors and actuators with different communication requirements.
Installation and maintenance:
Before installing the LAM 810-102361-222, it is essential to prepare the installation environment carefully. First, ensure that the control cabinet or equipment where it will be installed is clean and free of dust. Dust can accumulate on the circuit board and cause electrical problems over time, potentially interfering with the proper functioning of the safety interlocking mechanisms. Check the mounting area to make sure it has the correct dimensions and mounting holes to accommodate the board’s specified mounting type, such as screw – mounting on a DIN rail.
When it comes to electrical connections, double – check that the input voltage available is within the specified range of 24V DC ±5%. Connect the power supply wires securely, ensuring that there are no loose connections that could lead to intermittent power supply or electrical arcing. Grounding is also of utmost importance. Connect the LAM 810-102361-222 to a reliable ground source according to the electrical safety standards of your region. This helps to protect the board from electrical surges and interference, ensuring stable operation of the safety interlocking functions.
For maintenance, regular visual inspections are highly recommended. Periodically check the board for any signs of physical damage, such as cracks on the circuit board, loose components, or discolored areas. Inspect the connectors and cables attached to the board to ensure they are in good condition and properly seated. Signal diagnostics should also be carried out at regular intervals. Use appropriate testing equipment, such as a multimeter for electrical signals and a logic analyzer for digital signals, to verify that the input and output signals are functioning correctly. This can help detect any potential issues early on, such as a faulty sensor connection or a problem with the board’s internal signal processing. Additionally, stay updated with any firmware updates released by LAM Research. These updates often include bug fixes, performance enhancements, and improvements to the safety algorithms. Installing the latest firmware can help keep the LAM 810-102361-222 operating at its best and ensure its continued effectiveness in safeguarding semiconductor manufacturing equipment.
WhatsApp: +86 16626708626
Email: 3772179818@qq.com
Phone: +86 16626708626
