LAM 810-069751-114 high – performance printed circuit board (PCB)
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LAM 810-069751-114 high – performance printed circuit board (PCB)
The LAM 810-069751-114 is a high – performance printed circuit board (PCB) designed specifically for semiconductor manufacturing and related high – tech applications. It is a product of LAM Research, a globally recognized leader in providing advanced equipment and solutions for the semiconductor industry.
Model 810-069751-114
Brand LAM Research
Type Printed Circuit Board (PCB)
Power Supply 24V
Current Range 100 – 400A
Mounting screw – mounted on a specific chassis
Weight SPI, I2C
Cooling natural convection
The LAM 810-069751-114 is a high – performance printed circuit board (PCB) designed specifically for semiconductor manufacturing and related high – tech applications. It is a product of LAM Research, a globally recognized leader in providing advanced equipment and solutions for the semiconductor industry.
810-069751-114
As a PCB, the LAM 810-069751-114 serves as the backbone for various electronic components and circuits within semiconductor manufacturing equipment. It provides the physical platform for mounting and interconnecting different components, such as power regulators, microcontrollers, and communication interfaces.
In the overall architecture of semiconductor manufacturing systems, the LAM 810-069751-114 plays a central role. It interfaces with power sources, control units, and other peripheral devices, facilitating the flow of power and signals. For engineers and integrators working in the semiconductor field, this PCB offers significant value. Its compatibility with a wide range of semiconductor manufacturing equipment makes it easier to design and build new systems or upgrade existing ones. It simplifies the process of integrating different components, reducing the complexity and time required for system development.
810-069751-114
Main features and advantages:
The LAM 810-069751-114 offers several outstanding technical features and functional benefits. In terms of power handling, it is designed to work with a 24V power supply and can manage a current range of 100 – 400A. This makes it suitable for power – hungry applications in semiconductor manufacturing, such as driving high – power motors or providing stable power to sensitive electronic components.
The PCB’s design incorporates advanced materials and manufacturing techniques, ensuring excellent electrical performance. It has low resistance traces, which minimize power losses and heat generation during operation. This not only improves the efficiency of the connected devices but also extends their lifespan by reducing the stress on components due to excessive heat.
In terms of mechanical design, the LAM 810-069751-114 is rugged and durable. It can withstand the harsh environmental conditions typically found in semiconductor manufacturing plants, including temperature variations, vibrations, and chemical exposure. The board’s layout is optimized for easy installation and maintenance, with clearly marked connectors and components for quick identification and replacement if needed.
Compatibility is another strong suit of the LAM 810-069751-114. It is engineered to work seamlessly with a variety of semiconductor manufacturing equipment, regardless of the brand or specific model. It supports standard communication protocols used in the industry, such as SPI (Serial Peripheral Interface) and I2C (Inter – Integrated Circuit), enabling easy integration with other control and monitoring systems. This flexibility allows engineers to build customized semiconductor manufacturing setups that meet their specific requirements.
810-069751-114
Technical specifications:
Model 810-069751-114
Brand LAM Research
Type Printed Circuit Board (PCB)
Power Supply 24V
Current Range 100 – 400A
Mounting screw – mounted on a specific chassis
Weight SPI, I2C
Cooling natural convection
Contact Us Phone:+86 16626708626 WeChat/WhatsApp:+86 16626708626 Email: 3772179818@qq.com
Application areas:
In the fast – paced and highly precise world of semiconductor manufacturing, every component plays a crucial role in ensuring the seamless production of high – quality chips. The LAM 810-069751-114is no exception, being an integral part of the complex ecosystem that powers this industry.
Semiconductor fabrication plants rely on the LAM810-069751-114for a variety of critical functions. In the wafer processing stage, it is involved in power management systems that drive the various equipment used for etching, deposition, and lithography. For example, during the etching process, where the surface of the wafer is selectively removed to create intricate patterns, the LAM 810-069751-114 ensures a stable and adjustable power supply. This is essential as any fluctuations in power could lead to inaccurate etching depths or uneven patterns, resulting in defective semiconductor chips.
It also finds extensive use in robotic systems within the semiconductor factory. These robots are responsible for handling delicate wafers, moving them between different processing stations with utmost precision. The LAM 810-069751-114provides the necessary power regulation for the motors that drive these robotic arms, enabling smooth and accurate movements. This not only protects the valuable wafers from damage but also increases the overall efficiency of the production line.
Moreover, in test and measurement equipment used to evaluate the quality of semiconductor chips, the LAM 810-069751-114 is often utilized. It helps in powering the sensors and actuators that perform various tests, such as electrical conductivity and signal integrity tests. By providing a reliable power source, it ensures that the test results are accurate and consistent, which is vital for maintaining the high standards of the semiconductor industry.
Related products:
LAM 810 – 069751 – 104 – A related semiconductor controller from LAM Research. It may be used in conjunction with the LAM 810 – 069751 – 114 to provide additional control functions for semiconductor manufacturing processes. For example, it could handle the logic and command – sending tasks while the LAM 810 – 069751 – 114 focuses on power management and component interconnection.
LAM 810 – 048219 – 022 – Another printed circuit board by LAM Research. It might be part of a larger system where the LAM 810 – 069751 – 114 is also installed. It could have complementary functions, such as handling specific signal processing or providing additional input/output capabilities for the overall semiconductor manufacturing equipment.
LAM 605 – 109114 – 003 – A PCBA with a CPU 7668 VxWin. This module could work together with the LAM 810 – 069751 – 114 in a more complex semiconductor manufacturing setup. It might be responsible for high – level data processing and control, while the LAM 810 – 069751 – 114 manages the power and basic electrical connections for the system.
LAM 810 – 001489 – 016 – A PCBA rocker valve interface board. In some semiconductor manufacturing processes that involve fluid control or mechanical movement, this board could be integrated with the LAM 810 – 069751 – 114. The LAM 810 – 069751 – 114 would supply the necessary power, and the rocker valve interface board would control the movement of valves related to gas or liquid flow in the manufacturing process.
LAM 853 – 049542 – 173 – A circuit board module that may have applications in temperature control or other auxiliary functions within semiconductor manufacturing. It could be connected to the LAM 810 – 069751 – 114 to enhance the overall functionality of the manufacturing system. For instance, it might monitor and adjust the temperature of specific components, and the LAM 810 – 069751 – 114 would power this module and facilitate its communication with other parts of the system.
Installation and maintenance:
Before installing the LAM 810-069751-114, it is crucial to ensure that the installation area is clean and free from any debris. The board should be installed in a location with proper ventilation to prevent overheating, as high temperatures can significantly degrade its performance. Grounding is of utmost importance. A proper grounding connection will protect the board from electrical surges and ensure accurate signal transmission, which is critical in semiconductor manufacturing processes. Additionally, make sure that there is enough clearance around the board for easy access to its connectors and components during future maintenance or upgrades.
For maintenance, regular visual inspections are highly recommended. Check for any signs of physical damage, such as cracks on the board, burnt – out components, or loose connections. Periodic electrical testing should be carried out to verify that the board is operating within its specified power and signal parameters. Keeping the board clean from dust and contaminants is also important, as these can interfere with the electrical performance over time. If any issues are detected, it is advisable to refer to the official LAM Research documentation or contact their technical support team for guidance on replacement or repair procedures.
WhatsApp: +86 16626708626
Email: 3772179818@qq.com
Phone: +86 16626708626
