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IC695CPE330-AD GE PACSystems RX3i CPU Module

  • Product Model: IC695CPE330-AD
  • Product Brand: GE Fanuc / Emerson PACSystems
  • Product Series: RX3i
  • Product Features:
    • Dual-core 1 GHz processor with 64 MB user memory
    • Two independent high-speed Gigabit Ethernet ports + USB support
    • Up to 32K I/O words (discrete + analog) capability
    • Optional energy pack support (IC695ACC402) for non-volatile memory backup
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Description

  • Product Model: IC695CPE330-AD
  • Product Brand: GE Fanuc / Emerson PACSystems
  • Product Series: RX3i
  • Product Features:
    • Dual-core 1 GHz processor with 64 MB user memory
    • Two independent high-speed Gigabit Ethernet ports + USB support
    • Up to 32K I/O words (discrete + analog) capability
    • Optional energy pack support (IC695ACC402) for non-volatile memory backup
IC695CPU320-CF
IC695CPE330-AD

Applications & Industry Context

The IC695CPE330-AD is a powerhouse CPU in GE/Emerson’s PACSystems RX3i family, tailored for demanding automation applications where reliability, communication capacity, and scalability matter. In process manufacturing—such as chemical, petrochemical, or water/wastewater treatment—its high-speed Ethernet ports and large memory make it ideal for coordinating large I/O counts, logging data, and executing complex control strategies.

In production plants—packaging, automotive, consumer goods—the CPE330-AD can serve as a central controller in a multi-tier architecture. Its two Gigabit Ethernet channels allow separation of real-time control traffic (e.g., EGD or SRTP) from HMI or SCADA communications, minimizing interference and improving deterministic control.

Critical infrastructure also benefits. For example, in power generation or utilities, the module supports redundancy and failover capabilities. Engineers can pair it with energy packs or specialized modules to ensure that user logic is preserved during power fluctuations, protecting against data loss and minimizing risk.

Additionally, OEMs and machine builders value its form factor. The CPU sits in the RX3i backplane, which supports a broad range of I/O, including discrete, analog, motion, safety, and specialized option cards. This flexibility allows designers to build compact, modular systems that can be scaled or replicated across machine lines.