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Phone: +86 16626708626Description
- Real-World Use & Application Scenarios
In modern automation environments that deploy PROFIBUS networks within RX3i PacSystem architectures, the IC695PBM300-BC functions as a PROFIBUS Master module. It enables reliable, high-speed communication between an RX3i CPU and a broad array of PROFIBUS-DP devices—sensors, actuators, remote I/O, and field devices scattered across a plant floor. Engineers rely on this module to centralize device addressing, data mapping, and network diagnostics, which translates into streamlined engineering, faster commissioning, and easier maintenance. This Master module is especially valuable in manufacturing lines with distributed control schemes, where deterministic data exchange is essential for timing-critical operations such as batch sequencing, motion profiles, and safety interlocks. The IC695PBM300-BC typically sits in the RX3i universal backplane, sharing signaling standards and diagnostic conventions with other RX3i I/O and communication modules. In project documentation, BOMs, and service guides, the model name IC695PBM300-BC is cited to ensure correct procurement, network configuration, and future scalability within GE’s PacSystem ecosystem. Its presence signals a robust, scalable PROFIBUS network that supports reliable device communication, remote diagnostics, and centralized management across the production line. - Product Introduction & Positioning
The IC695PBM300-BC is a PROFIBUS Master module for GE’s RX3i PacSystem. Its core function is to configure and manage a PROFIBUS-DP network, orchestrating data exchange between the RX3i CPU and multiple DP slaves. Integrated into the RX3i chassis, it aligns with backplane interfaces, data handling conventions, and diagnostic tooling used across RX3i networked modules. The “BC” variant typically denotes a specific regional packaging, revision level, or feature set within the Master family. For engineers, this module provides centralized network control, scalable addressing, and reliable communication with field devices, enabling cohesive system design and easier long-term maintenance. The IC695PBM300-BC is frequently described in network design guides and service manuals as the standard Master solution for RX3i PROFIBUS networks, ensuring compatibility with existing GE automation investments and a straightforward upgrade path for expanding network reach.
- IC695PBM300-BC
- IC695PBM300-BC
- IC695PBM300-BC
- Key Technical Features & Functional Benefits
The IC695PBM300-BC delivers robust PROFIBUS Master capabilities including programmable data mapping, support for standard DP data blocks, and essential DP master features such as diagnostic counters and synchronization options. The module is designed for stable operation in industrial environments, with EMI-resistant signaling and reliable backplane communication that minimizes latency and data loss. Its software integration path typically includes GE’s engineering tools for DP configuration, addressing, and fault logging, enabling efficient commissioning and scalable network management. The hardware emphasizes rugged construction and thermal tolerance to maintain consistent performance in crowded cabinets. Compatibility with the RX3i backplane and GE’s software suite provides engineers with a cohesive workflow for network design, diagnostics, and remote support. The IC695PBM300-BC is positioned as a dependable Master option for networks that demand high data throughput, deterministic timing, and easy scalability within the RX3i PacSystem ecosystem. - Detailed Technical Specifications
| Parameter | Value |
|—|—|
| Model | IC695PBM300-BC |
| Brand | GE Fanuc RX3i PacSystem |
| Type | PROFIBUS Master module |
| Backplane Compatibility | RX3i universal backplane |
| Protocol | PROFIBUS-DP (DP-V0/DP-V1 features as applicable) |
| Data Throughput | Configurable DP master data sizes (exact numbers per datasheet) |
| Max Slaves Supported | Datasheet-defined limit (typical RX3i Master capacity) |
| Data Mapping | Configurable input/output data blocks per slave |
| Power Consumption | [To be confirmed] W |
| Operating Temperature | -40°C to 85°C (industrial) |
| Mounting | Rack-mount in RX3i chassis |
| Dimensions | Standard RX3i Master footprint |
| Weight | Moderate |
| Interfaces | Backplane signaling; PROFIBUS DP interface to slaves |
| Certifications | OEM safety and EMC standards |
| Cooling | Passive or cabinet airflow-driven, depending on chassis |
| Environmental Rating | Enclosure-dependent; verify OEM data | - Related Modules or Compatible Units
- IC695PBM300-CC – PROFIBUS Master variant with different regional packaging or DP feature tweaks
- IC695PBM300-BA – Alternate Master version for additional DP configurations
- IC695PBM202 – Earlier RX3i PROFIBUS Master option with smaller data footprint
- IC695CMM002 – Network interface module for RX3i network expansions
- IC695ALG708 – Analog I/O module to pair with PROFIBUS Master networks
- IC694PWR331C – RX3i power supply supporting backplane and DP networks
- IC695MDL741 – Diagnostic module supporting RX3i network health checks
- IC693CMM310 – Communication module for non-PACSystems RX3i configurations (cross-compatibility planning)
- Installation Notes & Maintenance Best Practices
During installation, ensure the RX3i rack is properly ventilated and that the Master module is seated firmly in its slot, with all backplane connections clean and undamaged. Document DP addresses, slave IDs, and data block mappings to facilitate future changes and troubleshooting. Maintain tidy cabling for DP field devices and ensure shielded cables where applicable to minimize EMI. Schedule regular network diagnostics using GE’s software tools to monitor DP communication health, error counters, and slave responsiveness. When applying firmware or configuration changes, validate them in a controlled test environment before deploying to production to avoid network-wide disturbances. Keep spare PBM modules on hand to minimize downtime during maintenance or expansion, and maintain an up-to-date network topology map for rapid fault isolation.
