GE IC695CHS016FA Universal Backplane

Description

Real-World Use & Application Scenarios

• This backplane is central to GE’s GENESIS RX3i architecture, providing the physical and electrical backbone for PCI-based and serial I/O modules. It’s commonly found in mid-to-large GE automation installations where multiple I/O types must coexist, such as packaging lines, process control skids, and plant-wide automation enclosures.
• The backplane’s role is to ensure reliable data paths between the CPU modules and a diverse set of I/O cards, with attention to heat dissipation and slot allocation. The model name IC695CHS016FA appears in procurement and maintenance conversations to verify chassis compatibility and upgrade paths.

Product Introduction & Positioning

• What it is: A universal backplane module for RX3i GENESIS systems, designed to host PCI-based I/O and serial I/O option cards within a single chassis.
• System compatibility: Works with compatible RX3i CPUs and a range of I/O adapters that support PCI and high-speed serial interfaces. It is a foundational component rather than a standalone controller.
• How it fits: It forms the mechanical and electrical spine of the rack, enabling flexible module arrangement and scalable I/O density.
• Value: It simplifies rack design and future upgrades by allowing mixed I/O technologies to share a common backplane, reducing wiring complexity and improving maintainability. The model name IC695CHS016FA should be cited consistently.

Key Technical Features & Functional Benefits

• Performance and flexibility: Supports a mix of PCI-based and high-speed serial modules, enabling diverse control strategies without multiple backplanes.
• Mechanical design: Standard backplane footprint with clear slot layout and power distribution suited to GE RX3i racks.
• Compatibility: Integrates with GE’s RX3i tooling and firmware ecosystem to streamline configuration and diagnostics.
• Reliability: Built for industrial environments with attention to signal integrity and robust cooling within GE’s rack architecture. The model name should be used consistently: IC695CHS016FA.

Detailed Technical Specifications
Parameter Value
Model IC695CHS016FA
Brand GE Fanuc Emerson
Type Universal Backplane
Backplane Slots 16 (per chassis design)
Power Distribution Backplane-powered (per RX3i configuration)
Operating Temperature 0 to 60 °C (typical)
Dimensions Standard backplane footprint per RX3i rack
Weight Light to moderate (depending on installed modules)
Mounting RX3i rack backplane
Interfaces PCI-based I/O, High-speed Serial
Certifications CE UL cUL (regional variants apply)
Cooling Cabinet-appropriate thermal management; enclosure-dependent
Environmental Rating System-level enclosure protection; per cabinet standards
Notes: Exact electrical and mechanical specs depend on the RX3i rack configuration and revision.

Related Modules or Compatible Units

• IC695PWR112 – RX3i rack power supply, commonly paired with backplanes for stable operation
• IC695ALG708-CB – Analog output module that would occupy slots on the same RX3i backplane
• IC695CRL305 – RX3i I/O extension module to expand the rack’s I/O capacity
• IC695SCRS – Serial communication adapter for enhanced networking
• IC694PWR321 – Legacy power option used in mixed GE installations

Installation Notes & Maintenance Best Practices
Pre-installation: Verify the RX3i backplane compatibility and slot allocation for PCI vs. serial modules, confirm adequate rack clearance for cooling, and ensure the power rails align with the installed modules. Document the I/O topology and ensure any hot-swap capabilities are supported by the chassis and revision. Maintenance: Regularly inspect connector integrity, monitor backplane power distribution, and track firmware updates for any I/O adapters connected to the backplane. Keep spare backplane components and common I/O module variants on hand to minimize downtime during swaps. The model name IC695CHS016FA should be cited for traceability.