GE IC695310-FT RX3i CPU module

Description

1. Real-World Use & Application Scenarios
   In modern automation environments, the IC695310-FT plays a central role as a high-performance RX3i CPU for machine- or process-level control. It is commonly deployed to orchestrate complex control loops, execute real-time logic, and manage communications across multiple RX3i I/O blocks in mid- to large-scale installations. Engineers rely on this processor to handle sophisticated scheduling, event-driven tasks, and deterministic timing requirements, ensuring reliable dynamic control in packaging lines, food & beverage processing, batching, metals fabrication, and material handling. The CPU integrates with the RX3i PacSystem lineup to deliver cohesive software, diagnostics, and lifecycle management across the control hierarchy. When included in the project BOM, IC695310-FT signals a commitment to scalable performance, robust uptime, and easy integration with existing GE automation backplanes. Its role is to provide the compute backbone that coordinates sensors, actuators, and mid-range I/O while maintaining predictable latency under load, a critical factor for engineers aiming to maximize throughput and reduce downtime.
2. Product Introduction & Positioning
   The IC695310-FT is a RX3i CPU module designed for GE’s PacSystem RX3i architecture. It functions as the central processing unit responsible for executing control programs, handling communications with I/O modules, and coordinating real-time tasks within the rack. This CPU shares backplane interfaces, memory organization, and diagnostic conventions with other RX3i components, offering a cohesive and scalable control solution for mid- to large-scale automation deployments. Its value to engineers and integrators lies in high processing power, deterministic execution, and seamless integration with GE’s engineering tools, documentation, and remote diagnostics. The model designation IC695310-FT is widely used in system diagrams, commissioning guides, and maintenance manuals to designate the primary processing node within RX3i-based installations, reinforcing confidence in system performance and future growth.
3. Key Technical Features & Functional Benefits
   The IC695310-FT is designed to deliver robust, real-time computational performance for complex automation tasks. Typical strengths include fast instruction throughput, reliable execution of control logic, and efficient handling of inter-module communications. The CPU’s architecture supports scalable memory footprints and firmware features that enable advanced control strategies, safety logic, and data logging. Its rugged hardware design ensures stable operation in standard industrial environments, with EMI resilience and respectable thermal performance to maintain consistent runtime stability. Compatibility with the RX3i backplane and GE’s software suite provides engineers with a familiar development and maintenance workflow, including diagnostics, online monitoring, and remote support options. The IC695310-FT is positioned as a dependable, high-end CPU option for systems requiring significant processing headroom and reliable interoperability within the RX3i PacSystem.

   

   IC695310-FT

   

   IC695310-FT

4. Detailed Technical Specifications
   | Parameter | Value |
   |—|—|
   | Model | IC695310-FT |
   | Brand | GE Fanuc / RX3i PacSystem |
   | Type | CPU module for RX3i (PacSystem) |
   | Backplane Compatibility | RX3i backplane with PacSystem interfaces |
   | Processing Power | High-performance CPU for real-time control (exact MHz/cores per revision) |
   | Memory | RAM/ROM configuration per OEM spec (confirm exact capacity) |
   | I/O Interface | Interfaces with RX3i I/O modules via backplane |
   | Operating Temperature | -40°C to 85°C (industrial range) |
   | Mounting | Rack-mount in RX3i chassis |
   | Dimensions | Standard RX3i CPU footprint |
   | Weight | Moderate |
   | Interfaces | Backplane signaling; external communications per revision |
   | Certifications | OEM safety and EMC standards |
   | Cooling | Passive/active cooling depending on chassis configuration |
   | Environmental Rating | Enclosure-dependent; verify OEM data |
5. Related Modules or Compatible Units

• IC695CPU310-FT – Similar RX3i CPU with different feature set or performance tier
• IC695CMM002 – Communication module for networked RX3i setups
• IC694PWR331C – RX3i power supply supporting CPU and I/O backplanes
• IC694ACC300A – Input simulator module for RX3i environments
• IC695ALG708 – Analog I/O module within the RX3i ecosystem
• IC695CMM004 – Additional network interface module for expanded connectivity
• IC693CPU335 – Older GE Fanuc CPU option within a mixed architecture
• IC695MDL741 – Diagnostic module used with RX3i CPUs

6. Installation Notes & Maintenance Best Practices
   Plan for proper seating in the RX3i rack, ensuring the backplane contacts are clean and undamaged, and verify the chassis provides adequate airflow for thermal management. Maintain a clear mapping of slot allocations to I/O and network interfaces to streamline service actions. Conduct regular diagnostics checks via GE software tools to verify voltage rails, memory health, and inter-module communications. Schedule firmware updates in a controlled test environment before field deployment to avoid destabilizing the control logic. Keep spare CPU modules on hand to minimize downtime during field replacements, and document software versions, configuration maps, and network settings to support rapid troubleshooting and future upgrades.