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GE IC694PWR331C high-capacity 24 VDC power supply module

The IC694PWR331C is a high-capacity 24 VDC power supply module for the GE Fanuc RX3i PacSystem. Its core function is to convert the system’s primary power into stable backplane power for the rack, supporting backplane loads and adjacent I/O modules. This module is designed to work seamlessly within the RX3i architecture, sharing mounting standards, electrical interfacing, and diagnostic conventions with other power and I/O modules in the family.

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Description

  1. Real-World Use & Application Scenarios
    In a broad range of automation environments, the IC694PWR331C serves as a high-capacity 24 VDC power supply module for GE Fanuc RX3i PacSystem installations. Plants with modular control cabinets, where backplane power stability directly influences control reliability, rely on this unit to deliver clean, dependable DC power to backplane circuits and connected I/O blocks. It’s especially beneficial in systems with multiple expansion modules, where peak loads and transient currents demand a robust supply that minimizes voltage sag and ripple. Typical use cases include packaging lines, material handling conveyors, process skids, and milling or stamping stations where steady power under varying loads reduces downtime and protects sensitive electronics from supply fluctuations. The module integrates into the RX3i backplane with familiar GE signaling conventions, enabling engineers to maintain a cohesive, scalable power architecture across the control rack. In practice, procurement documents, installation guides, and service manuals reference the full model name IC694PWR331C to ensure precise part matching for replacements and expansions, reinforcing confidence in long-term support. The IC694PWR331C is a trusted backbone in automation systems requiring reliable 24 VDC power, solid protection features, and straightforward integration with GE’s PacSystem lineup.
  2. Product Introduction & Positioning
    The IC694PWR331C is a high-capacity 24 VDC power supply module for the GE Fanuc RX3i PacSystem. Its core function is to convert the system’s primary power into stable backplane power for the rack, supporting backplane loads and adjacent I/O modules. This module is designed to work seamlessly within the RX3i architecture, sharing mounting standards, electrical interfacing, and diagnostic conventions with other power and I/O modules in the family. For engineers and integrators, the IC694PWR331C offers strong load handling, thermal performance, and a predictable supply that helps ensure consistent controller operation even under peak demand. Its positioning emphasizes reliability, scalability, and compatibility with existing GE backplanes, making it a go-to choice for cabinets that require dependable power delivery and straightforward lifecycle management. The model name IC694PWR331C is frequently cited in installation sheets and spare-part inventories to simplify procurement and maintenance planning for RX3i-based deployments.
  3. Key Technical Features & Functional Benefits
    The IC694PWR331C delivers robust DC power with high capacity, designed to sustain backplane current demands across multiple modules. Expect features such as stable regulation, low ripple, and protection mechanisms against overcurrent and short-circuit conditions, which shield the rack from disturbances during startup and switching events. Thermal design emphasizes reliable operation across a wide ambient range, with efficient heat dissipation in typical cabinet environments. The backplane interface is engineered for reliable signal integrity and easy integration with adjacent power and I/O modules, helping to minimize voltage drops that could impact sensitive devices. The module’s clear diagnostic indicators simplify fault isolation, enabling quick troubleshooting during commissioning and routine maintenance. The IC694PWR331C thus stands as a dependable power backbone for RX3i PacSystem architectures, delivering consistent performance and supporting uninterrupted operation of control systems.

    IC695CPU320-CF
    IC694PWR331C
    IC695CPU320-CF
    IC694PWR331C
  4. Detailed Technical Specifications
    | Parameter | Value |
    |—|—|
    | Model | IC694PWR331C |
    | Brand | GE Fanuc |
    | Type | High-capacity 24 VDC power supply (RX3i PacSystem) |
    | Backplane Compatibility | RX3i PacSystem backplanes compatible with GE Fanuc architectures |
    | Power Output | 24 VDC, high-capacity supply |
    | Power Rating | Up to specified wattage (exact value from datasheet) |
    | Input Voltage Range | [To be confirmed] VDC |
    | Regulation | Tight line/load regulation with low ripple |
    | Protection | Short-circuit, overcurrent, thermal protection |
    | Operating Temperature | -40°C to 85°C (industrial range) |
    | Mounting | Rack-mount in RX3i chassis |
    | Dimensions | Standard RX3i power module footprint |
    | Weight | Moderate |
    | Interfaces | Backplane signaling; input/output connections per backplane design |
    | Certifications | OEM safety/EMC standards |
    | Cooling | Passive convection; cabinet airflow |
    | Environmental Rating | Enclosure-dependent; verify OEM data |
  5. Related Modules or Compatible Units
  • IC694PWR330C – Adjacent high-capacity RX3i power supply variant with different ratings
  • IC694PWR332C – Another power supply option within RX3i PacSystem
  • IC694ACC300A – Input simulator/base accessory used with RX3i backplanes
  • IC694MDL753K – Output module in RX3i family for test and control tasks
  • IC694ALG708 – Analog/digital I/O module in the same cabinet ecosystem
  • IC693CPU335 – CPU module for hybrid RX3i configurations
  • IC694CMM002 – Communication module for networked RX3i setups
  • IC670BEM100 – Cross-family power management accessory used in mixed architectures
  1. Installation Notes & Maintenance Best Practices
    When installing the IC694PWR331C, verify that the backplane and cabinet are rated for the power and thermal load, and confirm that the power-supply rails are within spec before connecting. Ensure adequate clearance around the module for heat dissipation and maintain clean, organized wiring to prevent accidental disconnections during maintenance. Periodically inspect the module’s connectors and cabinet air passages to prevent heat buildup and to sustain stable output. Monitor the power supply’s status indicators during startup and normal operation to detect abnormal conditions early. If firmware or configuration utilities exist for RX3i power modules, perform updates in a controlled test environment before field deployment to avoid destabilizing the rack’s power architecture. Keep spare units on hand to minimize downtime in critical production lines and document any changes in the rack’s power topology for faster troubleshooting.