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GE IC694MDL660-CC 32-Point 24 VDC Input Module

The GE IC694MDL660-CC confronts these head-on as a 32-point, 24 VDC positive/negative logic input module in GE’s RX3i PACSystems lineup, engineered to consolidate high-density discrete I/O into a single slot while delivering per-point diagnostics that transform raw field states into actionable intelligence.

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Description

In the unforgiving cadence of industrial automation, where a single missed input from a proximity sensor or a delayed valve confirmation can derail an entire production sequence, the pressure to capture distributed discrete signals with absolute fidelity is relentless. Control engineers in high-throughput environments routinely wrestle with wiring sprawl across sprawling conveyor zones, voltage mismatches between field devices and PLC racks, or diagnostic gaps that leave open-wire faults undetected until they trigger emergency stops—issues that fracture system stability and inflate downtime with reactive troubleshooting. The GE IC694MDL660-CC confronts these head-on as a 32-point, 24 VDC positive/negative logic input module in GE’s RX3i PACSystems lineup, engineered to consolidate high-density discrete I/O into a single slot while delivering per-point diagnostics that transform raw field states into actionable intelligence.

Picture a high-speed bottling line where photoeyes and limit switches span 200 meters of machinery, or a material handling system synchronizing diverters and pushers across multi-level sorters—the GE IC694MDL660-CC becomes indispensable when modular, noise-immune signal acquisition is the linchpin of process control. It tackles the density dilemma by packing 32 isolated inputs into a compact footprint, supporting both sourcing and sinking field devices via jumper-selectable commons, which eliminates the need for intermediate terminal blocks or polarity adapters. In the wider industrial automation ecosystem, this module fuels predictive maintenance by feeding open-wire, short-circuit, and field power loss alerts directly into the PAC’s fault tables, enabling condition-based responses before anomalies escalate. For decision-makers, critical specs include its 2 ms input filter and 7 mA on-state current—details that govern response times in fast-cycling loops and compatibility with low-power sensors. By neutralizing these discrete I/O pain points, the GE IC694MDL660-CC forges a resilient signal chain, where every switch closure or sensor trip contributes to uninterrupted uptime and tighter cycle control in demanding environments.

Embedding the GE IC694MDL660-CC into your RX3i architecture is like deploying a vigilant gatekeeper at the field edge, where it aggregates 32 discrete inputs across four isolated groups and maps them seamlessly to the PAC’s %I memory for logic processing. This module snaps into any I/O slot of an RX3i universal backplane—local or remote—drawing 5 VDC from the bus while exposing a high-density 36-pin Fujitsu connector for streamlined field wiring via pre-terminated cables (like IC694CBL330). Each group of eight inputs shares a user-configurable common, with LED indicators per point flashing green for ON, amber for faults, and red for module errors, all backed by diagnostic bits in the controller’s reference tables.

In the control stack, it resides in the I/O subsystem, downstream of field devices and upstream of the CPU (e.e., IC695CPU320), where a proximity switch closure registers in under 2 ms, triggers a ladder rung, and drives an output—all within a 1 ms scan. Diagnostics integrate natively: open-wire detection flags a broken sensor lead, while field power monitoring alerts on lost 24 VDC supply, enabling selective channel isolation without halting the rack. Though protocol-agnostic at the field level, it leverages PROFINET or Ethernet/IP via the PAC’s built-in ports for remote visibility, allowing a SCADA client to poll input states alongside alarm logs. Envision the data path: a pallet sensor on group 3 toggles; the GE IC694MDL660-CC latches the transition, updates %I0033, and the CPU executes a divert sequence—meanwhile, a short-circuit on point 12 sets a fault bit, notifying operators via HMI without disrupting the other 31 channels. For deployment teams, its hot-swappable design and cable-locking mechanism minimize outages during expansions, making the GE IC694MDL660-CC a high-density workhorse that amplifies RX3i’s I/O granularity in distributed process control.

Specification Details
Model Number IC694MDL660-CC
Brand GE (Emerson)
Type 32-Point 24 VDC Input Module
Input Voltage 24 V DC (18–30 V)
Operating Temp Range -0°C to 60°C
Mounting Style RX3i Universal Backplane Slot
Dimensions 5.57 x 1.26 x 5.12 in (141.5 x 32 x 130 mm)
Weight 0.62 lbs (0.28 kg)
Interface/Bus RX3i Backplane / 36-Pin Fujitsu
Compliance CE, UL, CSA, ATEX
Supported Protocols Native RX3i (%I mapping)
Typical Power Draw 300 mA @ 5 V DC (backplane)

Opting for the GE IC694MDL660-CC delivers a leap in signal visibility that turns potential blind spots into strategic insights, as per-point diagnostics catch open wires or overcurrent events in real time, allowing technicians to swap a faulty sensor during a scheduled micro-stop rather than a full line purge. This granularity reduces engineering overhead; a single module replaces four 8-point units, slashing wiring terminations by 75% and freeing panel real estate for future expansions without backplane redesigns.

IC695CPU315-BB
IC694MDL660-CC
IC695CPU315-BB
IC694MDL660-CC
IC695CPU315-BB
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Reliability gains compound through isolation: each group’s independent common blocks ground noise from adjacent motor starts, ensuring a photoeye on point 1 isn’t corrupted by a solenoid on point 32—critical in EMI-heavy zones where unshielded runs once induced ghost triggers. Maintenance efficiency spikes with LED fault coding and %AI-status mapping, guiding a tech to the exact terminal in seconds, while the module’s 7 mA on-state threshold accommodates low-power reed switches without auxiliary relays. Performance holds firm across temperature swings, with filter times adjustable from 0.5 to 100 ms to balance noise rejection and response in high-vibration settings.

Over years, the module’s hot-swap capability and PROFINET-ready diagnostics defer obsolescence, enabling firmware-driven feature adds without hardware swaps. It’s a choice that crystallizes value in density, diagnostics, and durability—streamlining discrete I/O into a lean, future-proof asset for process control.

The GE IC694MDL660-CC thrives in automotive body shops, where it consolidates weld-gun proximity sensors and clamp feedbacks across robotic cells, delivering critical system uptime via isolated groups that defy arc-flash noise in 200 ms cycles. In e-commerce fulfillment, process control systems deploy it to monitor tote presence across multi-level sorters, its high-density wiring cutting cable trays by half while fast data cycles sync diverters with sub-second precision.

Food packaging lines also lean on it—tracking cap presence and fill levels in washdown zones, where IP67-rated cables and per-point diagnostics ensure high-reliability operation under continuous uptime mandates. From tire curing presses to pharmaceutical cartoners, the GE IC694MDL660-CC anchors industrial automation with dense, diagnostic-rich discrete I/O that drives compliance and velocity.

IC694MDL250 – 16-point 120 VAC input for line-voltage sensors

IC694MDL260 – 32-point 120 VAC high-density alternative

IC694MDL740 – 16-point 24 VDC output to pair with inputs

IC694MDL930 – Relay output module for mixed AC/DC loads

IC695PNC001 – PROFINET controller for network integration

IC694CBL330 – 3-meter 36-pin cable for field wiring

IC695CHS012 – 12-slot universal backplane for dense racks

IC695PSA040 – 40 W power supply for high-I/O loads

Before sliding the GE IC694MDL660-CC into an RX3i backplane, confirm slot eligibility—any I/O position works, but avoid CPU-adjacent slots if thermal stacking is tight; use the PACSystems config tool to verify 300 mA backplane draw against your PSU headroom. Check field power routing: supply 24 VDC to the module’s commons via the Fujitsu connector, and jumper groups per polarity (positive for sourcing, negative for sinking) to match your sensors—test with a DMM for <1 V drop across commons. Pre-wire the IC694CBL330 cable on the bench, torquing screws to 4.4 in-lbs and labeling groups to prevent cross-wiring; validate continuity end-to-end before rack-up. Post-insert, cycle power and monitor the module OK LED—solid green confirms handshake; if flashing, reseat or check backplane voltage at 5.1 V ±5%.

Sustaining the GE IC694MDL660-CC leans on its diagnostic depth: weekly HMI sweeps of %I fault bits to clear transient open-wire flags, paired with monthly terminal audits for corrosion in humid plants—clean with isopropyl if resistance exceeds 0.5 ohms. Quarterly, cycle all 32 points with a switch box to verify filter response; log any >2 ms deviations and adjust per-channel settings in logic if noise persists. In dusty environments, inspect the Fujitsu latch annually for debris, and re-torque cable screws to spec. A persistent fault on one group typically traces to field power sag—measure at the terminal under load before suspecting the module. This measured cadence, fueled by per-point status, keeps the GE IC694MDL660-CC as a low-touch, high-insight sentinel, freeing bandwidth for process refinement over signal chasing.