GE IC694MDL241 RX3i digital input module

Description

1. Real-World Use & Application Scenarios

• Used in GE RX3i backplanes to capture digital signals from sensors, switches, and pushbuttons across industrial processes.
• Suitable for automotive, packaging, metal fabrication, and general factory automation where multiple discrete inputs are needed in a compact IO block.
• The module’s group common and positive-logic inputs simplify panel wiring and provide predictable debouncing and fault reporting.

  

  IC694MDL241

  

  IC694MDL241

2. Product Introduction & Positioning

• Type: RX3i digital input module
• Channels: 16 inputs (configured in one or more groups with common references)
• Input Voltage: 24 VAC/VDC variants (exact per model) to match field sensors
• Role: Converts field signals into clean digital data for the RX3i CPU and I/O networks
• System fit: Plugs into RX3i I/O racks and interfaces via the backplane with GE’s diagnostic and programming toolchain

3. Key Technical Features & Functional Benefits

• 16 isolated digital inputs with group commons to simplify wiring and reduce crosstalk
• Compatible with 24 VAC or 24 VDC input signaling depending on variant
• Debounce and input conditioning suitable for factory environments
• Backplane-compatible with RX3i, enabling modular expansion
• Channel-level diagnostics and fault reporting for quick troubleshooting

4. Detailed Technical Specifications
   Parameter | Value (typical)
   Model | IC694MDL241
   Brand | GE Fanuc Emerson
   Type | 16-channel digital input module
   Input Voltage | 24 VAC or 24 VDC (variant-dependent)
   Group Common | Configurable per group (one or more common references)
   Isolation | Channel-to-channel isolation and backplane isolation
   Backplane Compatibility | RX3i backplane
   Mounting | RX3i I/O rack
   Dimensions | Standard RX3i analog/digital input footprint
   Weight | Light to moderate
   Logic Type | Positive logic (typical)
   Debounce | Per-channel debounce specification (per datasheet)
   Power Requirements | Backplane power
   Diagnostics | Input status indicators; fault reporting
   Operating Temperature | 0–60°C (typical; enclosure dependent)
   Certifications | Industrial safety and EMC compliance
5. Related Modules or Compatible Units

• IC694MDL240 – 8-channel or alternate input density within RX3i
• IC694MDL241-AD – Variant with different input type/range
• IC694MDL251 – Another RX3i input family option
• IC695MDL653H – Cross-family discrete I/O components for RX3i
• IC695PWR320 – RX3i power module to support racks
• IC695ALG001 – Analog I/O expansions compatible with RX3i CPUs

6. Installation Notes & Maintenance Best Practices
   Pre-installation considerations

• Ensure correct backplane slotting and compatibility with the RX3i rack and firmware baseline.
• Verify input wiring and sensor compatibility (24 VAC vs 24 VDC) to avoid damage or incorrect logic states.
• Plan cable management to minimize EMI; keep digital signals separated from power wiring where feasible.

Maintenance best practices

• Periodically verify input channel health using built-in diagnostics and check for stuck or noisy inputs.
• Maintain spare MDL241 units and common accessories for rapid field replacement.
• Document I/O mapping, channel configurations, and any sensor changes for audits and future upgrades.