GE IC693360-DK single-slot GE CPU module

Description

Real-World Use & Application Scenarios
In GE 90-30 and PACSystems ecosystems, the IC693360-DK CPU module often serves as a high-capacity controller workhorse for medium-to-large automation projects. It’s typically deployed in packaging lines, process skids, and machine cells that demand substantial I/O handling, fast scan rates, and reliable program execution across multiple racks. Engineers rely on it to run complex control strategies, manage extensive discrete I/O, and coordinate timing-critical tasks across an automation network. The module is favored for its single-slot footprint, which helps maximize rack density, and for compatibility with GE backplanes and configuration tools. When selecting a CPU for GE systems, buyers search for terms like “GE 90-30 CPU,” “single-slot PLC with high I/O,” and “industrial controller for multi-rack setups,” with IC693360-DK appearing as a strong option for scalable, resilient automation architectures.

Product Introduction & Positioning
The IC693360-DK is a single-slot GE CPU module designed for 90-30 and PACSystems-style backplanes, offering substantial user memory and expansive I/O capacity. It plugs into a GE backplane and orchestrates program execution, data handling, and communication with I/O blocks and network modules across multiple racks. In a control-system layout, this CPU sits at the center of the automation stack, processing logic, handling diagnostics, and coordinating data exchange with field devices and supervisory systems. The value to engineers and integrators lies in its high I/O throughput potential, robust fault handling, and compatibility with a broad GE ecosystem, enabling streamlined upgrades, easier maintenance, and scalable deployments. The model name should be consistently highlighted for indexing: IC693360-DK.

Key Technical Features & Functional Benefits
The IC693360-DK emphasizes high-performance control with ample user memory and substantial I/O capacity across multiple racks. Its architecture supports fast program execution, reliable interrupt handling, and efficient data transfer to and from field devices. The CPU’s robustness is complemented by GE’s backplane and peripheral modules, delivering predictable timing and cohesive system behavior across large automation landscapes. Its design aims to minimize downtime during upgrades and debugging, with straightforward configuration, diagnostics, and seamless integration with existing GE software environments. Overall, the IC693360-DK stands out as a trusted platform for demanding manufacturing environments that require scalable, resilient control across multi-rack installations.

Detailed Technical Specifications
Parameter Value
Model IC693360-DK
Brand GE 90-30 / PACSystems family
Type Single-slot CPU module
Power Supply Backplane power per system standards
Operating Temperature Industrial operating range (exact value to confirm)
Backplane Compatibility GE 90-30 backplane and compatible PACSystems backplanes
Memory 240 KB Configurable User Memory (exact value to confirm)
I/O Capacity (exact) across racks (confirm from datasheet)
Scan Rate (typical) (confirm from datasheet)
Dimensions (exact) to confirm from datasheet
Weight (exact) to confirm from datasheet
Cooling (exact) to confirm from datasheet
Certifications (exact) to confirm from datasheet
Environmental Rating (exact) to confirm from datasheet

Note: Please provide the official datasheet values for memory, I/O capacity, scan rate, dimensions, weight, cooling, certifications, and environmental rating to finalize the spec table precisely.

Related Modules or Compatible Units
Bolded items with brief connections:

• IC693360-DK – Core single-slot CPU for 90-30/PACSystems backplanes
• IC693ALG223 – Analog input module that pairs with this CPU for sensing tasks
• IC693ALG323 – Digital/analog I/O companion modules for expanded I/O
• IC693DSM302 – Communication module enabling networked data exchange
• IC693MCD – Motion control or high-speed communications partner
• IC693AUD – Analog output siblings for complete I/O symmetry
• IC693ENT – Environmental-rated variant for harsher installations

Installation Notes & Maintenance Best Practices
Pre-installation steps should confirm rack and backplane compatibility, available power budgets, and cooling for the CPU across all installed I/O modules. Ensure proper grounding and EMI shielding, especially in facilities with heavy motor loads or high-frequency equipment. Plan for cable management and accessible service clearances to streamline maintenance. After installation, implement a disciplined maintenance schedule focusing on memory integrity, firmware compatibility, and diagnostic checks. Regularly review system logs for fault codes, and keep spare CPUs and essential modules on hand to minimize downtime during upgrades or repairs. Document all configuration changes and maintain a current asset index for rapid troubleshooting.