Description
The CPCI-3840AH is a high-performance 3U CompactPCI CPU module widely used in industrial computing applications such as factory automation, railway systems, medical imaging, and other embedded control environments. It features a powerful Intel Pentium M or Celeron M processor, supporting up to 2MB L2 cache and up to 2GB of DDR SDRAM memory to handle demanding compute tasks and real-time processing reliably.
Designed for compact industrial chassis, the CPCI-3840AH integrates dual Gigabit Ethernet ports for high-speed networking and includes USB 2.0 interfaces and multiple display outputs (VGA, DisplayPort), making it versatile for various industrial HMI and control applications. The module supports PCI Express buses and IDE/SATA storage options for flexible system configurations.
- CPCI-3840AH
Operating temperatures range from -40°C to 70°C, making the CPCI-3840AH suitable for harsh factory or transportation environments. Compliance with regulatory standards such as FCC Class A, CE, RoHS, and railway standards like EN50121-4 guarantees rugged reliability and EMC performance required in industrial and safety-critical applications.
| Parameter | Value |
|---|---|
| Model | CPCI-3840AH |
| Brand | ADLINK (or OEM partners like Alstom) |
| Type | 3U CompactPCI CPU Module |
| Processor | Intel Pentium M / Celeron M with up to 2MB L2 cache |
| Memory | Up to 2 GB DDR SDRAM |
| Network Interfaces | Dual Gigabit Ethernet |
| I/O Interfaces | USB 2.0, VGA, DisplayPort |
| Storage Interfaces | IDE, SATA |
| Operating Temperature | -40°C to 70°C |
| Dimensions | 160 mm x 100 mm (3U form factor) |
| Compliance | FCC Class A, CE, RoHS, EN50121-4 |
| Application | Industrial automation, embedded control systems |
The CPCI-3840AH is frequently deployed in embedded control systems requiring compute-intensive operations and robust communications. Its modular design allows engineering teams to build scalable, customizable platforms addressing diverse industrial automation challenges. Installation requires precise chassis integration, proper cooling strategies, and grounding to optimize performance.





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